DPA test

DPA Destructive Physical Analysis

The Destructive Physical Analysis (DPA) activity is fundamental to ensure the quality of the lot purchased prior to the final mounting of the flight parts.

The DPA is characterized by different activities depending on the component type that is being investigated.

The first part of the DPA flow is common to all EEE parts starting from the external visual inspection of the parts as received and followed by a solderability and lead integrity tests where applicable.

The hermetical parts are seal tested. They are fine leak tested using He tracer gas. The Fine leak test is then followed by the gross leak test; performed using perfluorocarbon fluids. Prior to opening the parts with a sealed cavity are submitted to PIND test in order to ensure that no free particles are present in the cavity that may affect the normal device operation.

The next step in the DPA flow is the inspection of the internal assembly of the parts.

For example, passive components like capacitors, resistors, inductors and diodes will be microsectioned to ensure that the internal assembly is compliant with the applicable MIL or ESCC specifications.

On the other hand, parts like integrated circuits (IC), transistor or hybrid components will be delidded/depotted (depending of the type of package) and the inspected under optical and electronic microscopes. Here, the inspection has the aim to guarantee the correct assembly of the die within the package as well as inspect that the die is free of defect and the internal wires are correctly bonded.

Following the internal visual inspection, the internal wires are bond pull tested to verify that the minimum bond strength requirement is met.

A second SEM inspection is performed on IC after the removal of the glass that passivates the die surface. The aim of this second SEM inspection is to secure that the structures that form the contact between the multi-level metal runs are properly shaped and formed.

Finally, the parts will be die shear tested to verify the die attachment strength.

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