The failure analysis plays a key role in searching for circuit faults. It aims to identify the root cause of a malfunction or failure in order to correct it and to prevent the recurrence of the problem.

The failure history provided by the customer gives the basis to the analysis. The first step of the investigation is always a visual inspection followed by electrical verification of the reported failure. Then non-destructive tests are used to gather information without altering the component, e.g. seal test, PIND, X-Ray, etc.

The investigation then proceeds with increasing more destructive tests, such as delidding/decapping, passivation and/or metal removal, to assess the internal integrity of the device and to reach the failure root cause.