PIND stands for Particle Impact Noise Detection.
The PIND test method is considered a non-destructive test and is widely used in applications involving the selection of total batches on live or flight components. The PIND test is performed according to the MIL standards (MIL-STD-883C Method 2020) to detect loose particles in electronic components; these can in fact cause physical and electrical damage to the parts during their operating life thus must be avoided.
Contamination of bulk particles is a major cause of component failure. This contamination is often caused by dirt, fibers, solder residues and other components trapped inside the cavity during the sealing process.
RGM SPACE has the state-of-art Technology equipment and the heritage to perform this specific test.